Gap Pad HC 5.0

A soft and compliant gap filling material, Bergquist's Gap Pad HC 5.0 has a thermal conductivity of 5.0 W/m-K and delivers outstanding thermal performance with very low compression stress. The low modulus and unique filler package is ideal for applications that require minimal component or board stress during assembly yet demand high heat transfer across the interface with very low thermal resistance. Gap Pad HC 5.0 is the next generation of high-compliance, very soft gap filling materials that allow for superb interfacing and wet out, even to rough surfaces and topographies, which ensures uniform material coverage across the component and heat sink for maximum performance.

With high-compliance materials, low thixotropic stress during assembly and through power and thermal cycling is important for minimizing pressure and potential damage to solder interconnects. Compared to previous-generation materials, Gap Pad HC 5.0 offers better handling, an enhanced dielectric constant, improved volume resistivity, and better thermal impedance performance. Manufactured with a natural tack on both sides, Gap Pad HC 5.0 contains no thermally impeding adhesive layers and is available in a range of thickness from 0.508 mm up to 3.175 mm. Reinforced with fiberglass for shear and tear prevention, the Gap Pad TIM is also highly durable.