Advanced Thermal Solutions Inc Introduction to Heat Sinks

Introduction to Heat Sinks

Advanced Thermal Solutions Inc

This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.

Related Parts

ObrazManufacturer Part NumberOpisDostępna ilość CenaWyświetl szczegóły
HEAT SINK 31MM X 31MM X 19.5MMATS-51310R-C1-R0HEAT SINK 31MM X 31MM X 19.5MM0 - Immediate$71.89Wyświetl szczegóły
HEAT SINK 42.5 X 42.5 X 19.5MMATS-51425R-C1-R0HEAT SINK 42.5 X 42.5 X 19.5MM218 - Immediate$74.93Wyświetl szczegóły
HEAT SINK 19MM X 19MM X 7.5MMATS-52190B-C1-R0HEAT SINK 19MM X 19MM X 7.5MM433 - Immediate$37.54Wyświetl szczegóły
HEATSINK TO-220 W/TAB BLACKATS-PCB1049HEATSINK TO-220 W/TAB BLACK9089 - Immediate$8.79Wyświetl szczegóły
SUPERGRIP HEATSINK 19X19X7.5MMATS-X53190B-C1-R0SUPERGRIP HEATSINK 19X19X7.5MM0 - Immediate$77.43Wyświetl szczegóły
SUPERGRIP HEATSINK 23X23X12.5MMATS-X53230G-C1-R0SUPERGRIP HEATSINK 23X23X12.5MM0 - Immediate$85.11Wyświetl szczegóły
HEATSINKATS-1605-C1-R0HEATSINK461 - Immediate$89.75Wyświetl szczegóły
HEAT SINK 25MM X 25MM X 7.5MMATS-50250B-C0-R0HEAT SINK 25MM X 25MM X 7.5MM97 - Immediate$31.29Wyświetl szczegóły
HEAT SINK PASSIVE BGA SPREAD CLPATS-50250B-C3-R0HEAT SINK PASSIVE BGA SPREAD CLP66 - Immediate$38.79Wyświetl szczegóły
HEAT SINK 29X29 X 7.5MM W/O TIMATS-50290B-C0-R0HEAT SINK 29X29 X 7.5MM W/O TIM597 - Immediate$31.86Wyświetl szczegóły
HEAT SINK 29X29X12.5MM W/O TIMATS-50290G-C0-R0HEAT SINK 29X29X12.5MM W/O TIM0 - Immediate$33.64Wyświetl szczegóły
HEATSINK 29X29X17.5MM CUSTOM TIMATS-50290P-C4-R0HEATSINK 29X29X17.5MM CUSTOM TIM0 - Immediate$37.65Wyświetl szczegóły
HEAT SINK 31MM X 31MM X 7.5MMATS-50310B-C0-R0HEAT SINK 31MM X 31MM X 7.5MM0 - Immediate$34.57Wyświetl szczegóły
HEATSINK 31MMX31MMX12.5MM W/O TIATS-50310G-C0-R0HEATSINK 31MMX31MMX12.5MM W/O TI0 - Immediate$34.31Wyświetl szczegóły
HEAT SINK 35MM X 35MM X 7.5MMATS-50350B-C0-R0HEAT SINK 35MM X 35MM X 7.5MM0 - Immediate$32.32Wyświetl szczegóły
HEATSINK 35MMX35MMX12.5MM W/O TIATS-50350G-C0-R0HEATSINK 35MMX35MMX12.5MM W/O TI9 - Immediate$35.68Wyświetl szczegóły
HEAT SINK 31MM X 31MM X 12.5MMATS-50350P-C3-R0HEAT SINK 31MM X 31MM X 12.5MM225 - Immediate$46.68Wyświetl szczegóły
HEATSINK 40X40X12.5MMATS-50400G-C3-R0HEATSINK 40X40X12.5MM89 - Immediate$42.89Wyświetl szczegóły
HEAT SINK T766ATS-50450G-C3-R0HEAT SINK T766657 - Immediate$40.18Wyświetl szczegóły
PTM Published on: 2020-04-03

Related Videos

ATS fanSINK™ Heat Sink Family Overview
ATS fanSINK™ Heat Sink Family Overview

Publish Date: 2021-11-01

How To Install The superGRIP™ Heat Sink Attachment
How To Install The superGRIP™ Heat Sink Attachment

Publish Date: 2020-01-24

MEMS Oscillator ruggedness vs quartz part 2
MEMS Oscillator ruggedness vs quartz part 2

Publish Date: 2018-03-13

Related Product Highlight

Expert Thermal Management of PCIe® Cards ATS PCIe® extrusion profiles are off the shelf solutions specifically for the thermal management of PCIe cards.
Heat Sink Attachment Solutions Advanced Thermal Solutions' heat sink attachments give engineers multiple options to mechanically attach almost any heat sink to PCBs.
dualFLOW™ and quadFLOW™ Ultra-Cool High-Performance Active Coolers Advanced Thermal Solutions’ dualFLOW and quadFLOW coolers provide at least 20% improvement in thermal performance when compared to other CPU coolers.

Related Articles and Blogs

Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.
Air Flow Measurement in Electronic Systems An analysis of circuit board air flow measurement techniques and the considerations required to obtain an accurate reading in this complex environment.

Related Product Training Modules

maxiFLOW Power Brick Heat Sink Technology ATS’s power brick heat sinks are engineered to create minimum pressure drop and maximize fin surface area
maxiGRIP™ and Board Rework Costs maxiGrip delivers enhanced cooling and enables the user to avoid any damage to the PCB and the BGA package itself.
maxiGRIP™ Flip-Chip Overview of the maxiGRIP Flip-Chip and review of importance of selecting the correct TIM.