Name: 374324B60023G
Brand: Boyd Laconia, LLC
SKU: HS522-ND
Price: 16.3836 PLN
Availability: InStock

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374324B60023G
DigiKey Part Number	HS522-ND
Manufacturer	Boyd Laconia, LLC
Manufacturer Product Number	374324B60023G
Description	BGA HEAT SINK
Manufacturer Standard Lead Time	14 Weeks
Customer Reference
Detailed Description	Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level
Datasheet	Datasheet

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Category Fans, Blowers, Thermal Management Thermal Heat Sinks	Length 1.063" (27.00mm)
Mfr Boyd Laconia, LLC	Width 1.063" (27.00mm)
Series 37432	Fin Height 0.394" (10.00mm)
Packaging Bulk	Power Dissipation @ Temperature Rise 1.5W @ 50°C
Part Status Active	Thermal Resistance @ Forced Air Flow 6.00°C/W @ 500 LFM
Type Board Level	Thermal Resistance @ Natural 30.60°C/W
Package Cooled BGA, FPGA	Material Aluminum
Attachment Method Solder Anchor	Material Finish Black Anodized
Shape Square, Pin Fins	Base Product Number 374324

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In-Stock: 1 983

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Unit Price without VAT:	13,32000 zł
Unit Price with VAT:	16,38360 zł

374324B60023G