Name: 374324B00035G
Brand: Boyd Laconia, LLC
SKU: HS318-ND
Price: 11.7096 PLN
Availability: InStock

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374324B00035G
DigiKey Part Number	HS318-ND
Manufacturer	Boyd Laconia, LLC
Manufacturer Product Number	374324B00035G
Description	HEATSINK BGA W/ADHESIVE TAPE
Manufacturer Standard Lead Time	14 Weeks
Customer Reference
Detailed Description	Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
Datasheet	Datasheet

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Category Fans, Blowers, Thermal Management Thermal Heat Sinks	Length 1.063" (27.00mm)
Mfr Boyd Laconia, LLC	Width 1.063" (27.00mm)
Series 37432	Fin Height 0.394" (10.00mm)
Packaging Box	Power Dissipation @ Temperature Rise 3.0W @ 90°C
Part Status Active	Thermal Resistance @ Forced Air Flow 9.30°C/W @ 200 LFM
Type Board Level	Thermal Resistance @ Natural 30.60°C/W
Package Cooled BGA, FPGA	Material Aluminum
Attachment Method Thermal Tape, Adhesive (Included)	Material Finish Black Anodized
Shape Square, Pin Fins	Base Product Number 374324

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In-Stock: 2 483

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Unit Price without VAT:	9,52000 zł
Unit Price with VAT:	11,70960 zł

374324B00035G