



ESQ-110-23-G-S | |
|---|---|
DigiKey Part Number | SAM11097-ND |
Manufacturer | Samtec Inc. |
Manufacturer Product Number | ESQ-110-23-G-S |
Description | CONN SOCKET 10POS 0.1 GOLD PCB |
Manufacturer Standard Lead Time | 4 Weeks |
Customer Reference | |
Detailed Description | 10 Position Elevated Socket Connector 0.100" (2.54mm) Through Hole Gold |
Datasheet | Datasheet |
EDA/CAD Models | ESQ-110-23-G-S Models |
Type | Description | Select All |
|---|---|---|
Category | ||
Mfr | ||
Series | ||
Packaging | Tube | |
Part Status | Active | |
Connector Type | ||
Contact Type | Forked | |
Style | Board to Board | |
Number of Positions | ||
Number of Positions Loaded | All | |
Pitch - Mating | ||
Number of Rows | 1 | |
Row Spacing - Mating | - | |
Mounting Type | Through Hole | |
Termination | ||
Fastening Type | Push-Pull | |
Contact Finish - Mating | ||
Contact Finish Thickness - Mating | 20.0µin (0.51µm) | |
Insulation Color | Black | |
Insulation Height | 0.535" (13.60mm) | |
Contact Length - Post | 0.190" (4.83mm) | |
Operating Temperature | -55°C ~ 125°C | |
Material Flammability Rating | UL94 V-0 | |
Contact Finish - Post | Gold | |
Mated Stacking Heights | - | |
Ingress Protection | - | |
Features | - | |
Current Rating (Amps) | 5.7A per Contact | |
Voltage Rating | 550VAC | |
Applications | - | |
Insulation Material | Liquid Crystal Polymer (LCP) | |
Contact Shape | Square | |
Contact Material | Phosphor Bronze | |
Contact Finish Thickness - Post | 3.00µin (0.076µm) | |
Base Product Number |
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | 9,85000 zł | 9,85 zł |
| 10 | 8,35900 zł | 83,59 zł |
| 100 | 7,10260 zł | 710,26 zł |
| 500 | 6,34014 zł | 3 170,07 zł |
| 1 000 | 6,03765 zł | 6 037,65 zł |
| 5 000 | 5,84676 zł | 29 233,80 zł |
| Unit Price without VAT: | 9,85000 zł |
|---|---|
| Unit Price with VAT: | 12,11550 zł |



