HSB16-404018
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
HSB16-404018
How to Select a Heat Sink

HSB16-404018

DigiKey Part Number
2223-HSB16-404018-ND
Manufacturer
Same Sky (Formerly CUI Devices)
Manufacturer Product Number
HSB16-404018
Description
HEAT SINK, BGA, 40 X 40 X 18 MM
Manufacturer Standard Lead Time
24 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Aluminum Alloy 9.4W @ 75°C Top Mount
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Same Sky (Formerly CUI Devices)
Series
HSB
Packaging
Box
Part Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive (Not Included)
Shape
Square, Pin Fins
Length
1.575" (40.00mm)
Width
1.575" (40.00mm)
Diameter
-
Fin Height
0.709" (18.00mm)
Power Dissipation @ Temperature Rise
9.4W @ 75°C
Thermal Resistance @ Forced Air Flow
2.60°C/W @ 200 LFM
Thermal Resistance @ Natural
7.96°C/W
Material
Aluminum Alloy
Material Finish
Black Anodized
Product Questions and Answers

See what engineers are asking, ask your own questions, or help out a member of the DigiKey engineering community

In-Stock: 836
Check for Additional Incoming Stock
Quantity
All prices are in PLN
Box
QuantityUnit PriceExt Price
18,75000 zł8,75 zł
107,74100 zł77,41 zł
257,37400 zł184,35 zł
507,10840 zł355,42 zł
1006,85190 zł685,19 zł
2506,52620 zł1 631,55 zł
5006,29000 zł3 145,00 zł
1 2805,98302 zł7 658,27 zł
5 1205,55657 zł28 449,64 zł
Manufacturers Standard Package
Unit Price without VAT:8,75000 zł
Unit Price with VAT:10,76250 zł
You May Also Be Interested InSee All
7 Items
HSB37-404023

HSB37-404023

HEAT SINK, BGA, 40 X 40 X 23 MM

Same Sky (Formerly CUI Devices)

11,93000 zł
HSB19-272718

HSB19-272718

HEAT SINK, BGA, 27 X 27 X 18 MM

Same Sky (Formerly CUI Devices)

7,25000 zł
HSB21-454515

HSB21-454515

HEAT SINK, BGA, 45 X 45 X 15 MM

Same Sky (Formerly CUI Devices)

8,38000 zł
TGH-0400-03

TGH-0400-03

ALUMINIUM HEAT SINK 40X40MM

t-Global Technology

14,90000 zł
375024B00032G

375024B00032G

HEATSINK BGA W/ADHESIVE TAPE

Boyd Laconia, LLC

13,83000 zł
655-53AB

655-53AB

HEATSINK CPU 40.6MM SQ H=.525"

Wakefield Thermal Solutions

8,60000 zł
HSB17-404025

HSB17-404025

HEAT SINK, BGA, 40 X 40 X 25 MM

Same Sky (Formerly CUI Devices)

9,88000 zł