Heat Sink BGA Copper Top Mount
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

HBA25031-10/CU/Y

DigiKey Part Number
4573-HBA25031-10/CU/Y-ND
Manufacturer
Malico Inc.
Manufacturer Product Number
HBA25031-10/CU/Y
Description
CU HEAT SINK 25X25X10MM WITH LIN
Manufacturer Standard Lead Time
5 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Copper Top Mount
Product Attributes
Type
Description
Select All
Category
Mfr
Malico Inc.
Series
HBA
Packaging
Tray
Part Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Clip
Shape
Square, Fins
Length
0.984" (25.00mm)
Width
0.984" (25.00mm)
Diameter
-
Fin Height
0.307" (7.80mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Material
Copper
Material Finish
-
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In-Stock: 35
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Quantity
All prices are in PLN
Tray
QuantityUnit PriceExt Price
119,40000 zł19,40 zł
1017,15400 zł171,54 zł
2516,34120 zł408,53 zł
5015,75120 zł787,56 zł
10015,18170 zł1 518,17 zł
25014,45980 zł3 614,95 zł
45014,01422 zł6 306,40 zł
95013,46711 zł12 793,75 zł
Manufacturers Standard Package
Note: Due to DigiKey value-add services the packaging type may change when product is purchased at quantities beneath the standard package.
Unit Price without VAT:19,40000 zł
Unit Price with VAT:23,86200 zł
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