Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
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70-4105-0810

DigiKey Part Number
70-4105-0810-ND
Manufacturer
Manufacturer Product Number
70-4105-0810
Description
SOLDER PASTE NO CLEAN 500GM
Manufacturer Standard Lead Time
2 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Datasheet
 Datasheet
Product Attributes
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Category
Flux Type
No-Clean
Manufacturer
Kester Solder
Mesh Type
3
Series
Process
Lead Free
Packaging
Bulk
Form
Jar, 17.64 oz (500g)
Part Status
Active
Shelf Life
12 Months
Type
Solder Paste
Shelf Life Start
Date of Manufacture
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Storage/Refrigeration Temperature
32°F ~ 50°F (0°C ~ 10°C)
Melting Point
423 ~ 424°F (217 ~ 218°C)
Base Product Number
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
Available To Order
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All prices are in PLN
Bulk
QuantityUnit PriceExt Price
10628,74200 zł6 287,42 zł
Manufacturers Standard Package
Unit Price without VAT:628,74200 zł
Unit Price with VAT:773,35266 zł