Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
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Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
APF19-19-10CB
APF19-19-10CB

APF19-19-10CB

DigiKey Part Number
294-1147-ND
Manufacturer
Manufacturer Product Number
APF19-19-10CB
Description
HEATSINK LOW-PROFILE FORGED
Manufacturer Standard Lead Time
14 Weeks
Customer Reference
Detailed Description
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
Datasheet
 Datasheet
Product Attributes
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Category
Shape
Square, Fins
Mfr
Length
0.748" (19.00mm)
Series
Width
0.748" (19.00mm)
Packaging
Box
Fin Height
0.370" (9.40mm)
Part Status
Active
Thermal Resistance @ Forced Air Flow
5.30°C/W @ 200 LFM
Type
Top Mount
Material
Package Cooled
Material Finish
Black Anodized
Attachment Method
Thermal Tape, Adhesive (Not Included)
Base Product Number
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
Substitutes (1)
Part NumberManufacturerQuantity AvailableDigiKey Part NumberUnit PriceSubstitute Type
HSB31-212105Same Sky (Formerly CUI Devices)1 4522223-HSB31-212105-ND3,20000 złSimilar
In-Stock: 24 246
Check for Additional Incoming Stock
All prices are in PLN
Box
QuantityUnit PriceExt Price
114,47000 zł14,47 zł
1012,81200 zł128,12 zł
2512,20440 zł305,11 zł
5011,76280 zł588,14 zł
10011,33760 zł1 133,76 zł
30010,69447 zł3 208,34 zł
60010,30715 zł6 184,29 zł
1 2009,93335 zł11 920,02 zł
Manufacturers Standard Package
Unit Price without VAT:14,47000 zł
Unit Price with VAT:17,79810 zł