SMD to DIP TSSOP 16 0.026" (0.65mm) FR4 Epoxy Glass
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PA0193

DigiKey Part Number
PA0193-ND
Manufacturer
Manufacturer Product Number
PA0193
Description
TSSOP-16-EXP-PAD TO DIP-16 SMT
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
SMD to DIP TSSOP 16 0.026" (0.65mm) FR4 Epoxy Glass
Datasheet
 Datasheet
Product Attributes
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Category
Package Accepted
TSSOP
Manufacturer
Chip Quik Inc.
Number of Positions
16
Series
Pitch
0.026" (0.65mm)
Packaging
Bulk
Board Thickness
0.062" (1.57mm) 1/16"
Part Status
Active
Material
FR4 Epoxy Glass
Proto Board Type
SMD to DIP
Size / Dimension
0.700" x 0.800" (17.78mm x 20.32mm)
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 57
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All prices are in PLN
Bulk
QuantityUnit PriceExt Price
119,00000 zł19,00 zł
Manufacturers Standard Package
Unit Price without VAT:19,00000 zł
Unit Price with VAT:23,37000 zł